Master Bond Polymer System EP30DPMED
Master Bond Polymer System EP30DPMED is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such...
Potting & Encapsulation Materials
Master Bond Inc. offers a broad line of potting and encapsulation materials designed to protect electronic circuitry and assemblies from potentially damaging conditions such as moisture, various corrosive chemicals, excessive heat, vibration, mechanical impact, thermal shocks and abrasion which...
Heat Resistant Epoxy Compound for High Performance Bonding and Sealing - EP21TCHT-1
Master Bond Polymer System EP21TCHT-1 is a two component, thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. It passes NASA low outgassing certification. Product advantages include: - Convenient mixing:...
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